Single-wafer plasma etching device "EXAM-Σ"
Carefully responding to niche demands. Light etching and ashing for thin wafers and double-sided processing, compact type CtC etching equipment.
A plasma etching device that realizes automatic sheet transport of thin wafers (100μm or less). It supports a wide range of processes with multi-mode plasma and step processes, from natural oxide film removal to thick film resist ashing, cleaning, and descumming. It is actively used in mass production environments for various devices such as discrete ICs, power devices, compound semiconductors, and MEMS, employing diverse processes.
- Company：神港精機 東京支店
- Price：Other
